Test method for the measurement of moisture diffusivity and water solubility in organic materials used in integrated circuits

Publisher:
International Electrotechnical Commission - Publicly Available Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

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Details the procedures for the measurement of characteristic bulk material properties of moisture diffusivity and water solubility in organic materials used in the packaging of IC components. These two material properties are important parameters for the effective reliability performance of plastic packaged ICs after exposure to moisture and subjected to high temperature solder reflow.

Edition :	1.0
File Size :	1 file , 220 KB
Note :	This product is unavailable in Canada
Number of Pages :	9
Published :	03/12/2002

IEC/PAS 62307 Ed. 1.0 en:2002 PDF

Test method for the measurement of moisture diffusivity and water solubility in organic materials used in integrated circuits

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